New Temperature Sensor May Simplify Thermal Monitoring for Circuits

Researchers at the University of Tokyo recently developed a new type of thermal sensor on a lightweight rolled-plastic base

As electronic devices become smaller and more powerful, they also generate more heat that can affect their performance and reliability. The traditional methods of cooling, such as cutting holes in the case or adding a fan, are no longer sufficient.

The thin film can go where many other sensors cannot. Further, it can be put in place during manufacturing for lifetime monitoring without a significant impact on the mechanical arrangements of the product.

The new sensors from UT use a less commonly known but related thermoelectric/thermomagnetic effect called the anomalous Nernst effect (ANE). Like The Seebeck effect, ANE converts heat into electricity.