Flexible RFID inlays bring NFC capabilities to paper packaging

Tageos and Pragmatic Semiconductor have expanded their partnership with the launch of new FlexIC-based RFID products designed to add NFC functionality to paper packaging and labels.

The new product lineup includes the EOS Lite and EOS Zero Lite families, both powered by Pragmatic’s NFC Connect PR1301 chip. Among the new releases is the EOS-932 Zero Lite PR1301, which the companies describe as their first paper-based NFC inlay.

The technology is aimed at making smart packaging more practical for large-scale use by reducing material consumption, lowering costs, and improving sustainability. By combining a paper antenna with an ultra-thin flexible chip, the inlays can be embedded into packaging without significantly altering its appearance or feel.  

The companies say the solution could be used for a range of applications, including product authentication, supply chain tracking, brand protection, and direct consumer engagement through smartphones.

Because the flexible chip can adapt to curved surfaces and lightweight packaging formats, it may help overcome limitations often associated with traditional RFID and NFC components, such as thickness, rigidity, and recyclability concerns.  

Prototype samples of the EOS-932 Zero Lite PR1301 are expected to become available by the end of the second quarter of 2026, while large-scale orders are scheduled to begin in the third quarter.