NXP and Stora Enso Partner to Integrate RFID into Packaging Solutions

NXP Semiconductors and Stora Enso have entered into joint development of intelligent packaging solutions. The development will focus on integrating RFID (Radio frequency identification) into packages for consumer engagement and supply chain purposes.

The collaboration will also focus on brand protection and the development of tamper evidence applications. These solutions will benefit both consumers and brand owners.

By using NXP RFID technology such as near field communication (NFC) and ultra-high frequency (UHF), Stora Enso smart packages can be easily tracked and traced through the entire supply chain providing full end-to-end transparency. The integrated technology is also able to detect if the smart package has been tampered with en route to the consumer and, once in the hands of the consumer, can provide additional information and interaction through (the tap of) an NFC-enabled smart phone. This visibility and insight is critical for brands and major manufacturers to ensure their products are being shipped and handled correctly. For consumers the benefits are two-fold; the smart packaging can verify the authenticity of the product and also provide care, usage and other important information via the NFC-enabled tag.