Flexible system-on-chip for internet-of-things

As the ecosystem of everyday objects embedded with technology to connect, communicate and transfer information continues to expand, scientists are challenged to find ways to enable even more physical objects to become 'smarter' and connected. Leveraging the U.S. silicon manufacturing industry's expertise in rigid electronics and novel efforts in high-performance electronics 3D printing, a collaborative effort between the Air Force Research Laboratory and American Semiconductor has resulted in a new flexible silicon-on-polymer chip that combines the best of the old and new to augment new networked realities.