GlobalFoundries and IDEMIA Secure Transactions to Enable Next-Generation Smart Card IC on GF 28ESF3 Platform

GlobalFoundries announced its collaboration with IDEMIA Secure Transactions (IST), a division of IDEMIA Group, to deliver IST’s new smart card IC on GF’s 28ESF3 process technology platform. This announcement marks a two-year partnership to create a 100% European value chain and efficient one-stop-shop solution for the next generation of IST’s smart card technology.

Announced at GF’s annual Technology Summit in 2023, GF’s 28ESF3 platform integrates ESF3 embedded non-volatile memory (NVM) into the GF 28SLPe foundry process. The platform offers a unique value proposition for smart card solutions, delivering improved data retention, low read latency and enhanced power efficiency. The platform also offers customers significant cost and time savings for developers through a streamlined manufacturing process with 40% less complexity than competitive platforms, readily accessible Smart Card Flash macros and custom macro design that simplify integration and accelerate time to market.

This collaboration also highlights GF’s extensive turnkey service offerings, including the availability of wafer sort using Known-Good-Die (KDG) methodology. Through this process, GF will supply die products that meet the high quality and reliability requirements for smart card solutions while streamlining the path to production.

The new smartcard IC is scheduled for mass production by 2026 at GF’s high-volume manufacturing facility in Dresden, Germany. As an ISO 15048 EAL6-certified facility, GF’s Dresden facility meets the highest standards for manufacturing security products like smart card technologies, ensuring an efficient and secure supply chain that saves customers considerable time and costs.