Tageos launches microwave-compatible RAIN RFID inlays for packaged food

Tageos has launched two RAIN RFID inlays designed for packaged food that can be defrosted or heated in a microwave. The EOS-450 MW M830 and EOS-450 MW UX combine item-level identification with antenna designs engineered to resist arcing and sparking under defined microwave conditions.

The new inlays are aimed at the growing use of RAIN RFID in food retail and quick-service restaurants. By allowing the RFID label to remain on suitable packaging throughout the product lifecycle, the technology can support applications including inventory and expiry-date management, traceability, loss prevention and self-checkout.

The two variants use different RFID chip platforms. The EOS-450 MW M830 is based on the Impinj M830 and provides 128-bit EPC memory, AutoTune performance and Gen2X enhancements. The EOS-450 MW UX uses NXP’s UCODE X platform, with configurable EPC memory ranging from 96 to 208 bits, up to 32 bits of user memory, low power consumption and Gen2v2 compliance.

Tageos is offering the inlays in dry, wet-clear, paper-face and plastic-face formats. This gives label converters and service bureaus several options for integrating RFID into different food-packaging constructions.

The company says the two products are the first step toward a broader range of microwave-compatible RAIN RFID inlays. Additional variants are planned to address different packaging formats and applications.

Tageos presented the new products at LOUPE Americas 2026 in Chicago. The company says the development responds to increasing demand for RFID solutions that can provide item-level visibility while meeting the specific handling requirements of packaged food.